Chip Quik WS991AX500T4 Thermally Stable Solder Paste WS (Water-Soluble) Sn63/Pb37 T4 (500g jar)
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Product details
| Management number | 209981478 | Release Date | 2026/04/02 | List Price | US$29.98 | Model Number | 209981478 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
Description Chip Quik 991 Series Thermally Stable Solder Paste Water-Soluble Sn/Pb in 500g jar. Revolutionary Formula: No Refrigeration Required! Alloy: Sn63/Pb37 Flux Type: Synthetic Water-Soluble Flux Classification: REL0 Metal Content: 90% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 183C (361F) Size: 500g jar Shelf Life Refrigerated >6 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
| Material | Solder Paste |
|---|---|
| Item Weight | 1.1 pounds |
| Part Number | WS991AX500T4 |
| Manufacturer | Chip Quik |
| Item model number | WS991AX500T4 |
| Batteries Included | No |
| Batteries Required | No |
| Package Dimensions | 3 x 3 x 3 inches |
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